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APPROACHES TO THERMAL Utiiwi * _ > j J. _ i .. nn>rtrAHiir*( . 4.1 MjnaamenLai aspeuw A o runHamohtal thermal orinciDles. H . C 1 "' 4 3 Design approaches. 4^4 Basic thermal design procedures. 4*5 Step-by-step procedure. . * - *r\A mncerVA tism. 4.6 stress eiicv.uj a 7 Thermal reliability requirements. 4*8 Methods of thermally rating parts and equipment. 4^9 Methodsfor minimizing heat dissipation. 4.10 Units ana conversion factors. 5. DETERMINATION OF THERMAL REQUIREMENTS 5*1 General considerations. 5-? and reliability. 5.3 Keiavionsmy uewrecu w -7* -r * hjmAf-ftc of thermal reliability. n ii ^ j ^ v w ^ 1 w ^ - s\5 Determination of the maximum parts temperature. 6. THERMAL DESIGN REQUIREMENTS nf hMt: flow. h I ticturn.ai BIW IVJJ V> k 9 Determination of required thermal resistances. 6*3 Tentative ass1gnment of thermal resistance values 6.4 Computer assisted thermal analysis. tuc cci rrrtnu OF OPTIMUM COOLING METHODS / , I I lb tfbbteWl w 7.1 General. 7.2 Heat transfer within 7 3 Heat transfer to the ultimate s.fu. 7.4 Tradeoff techniques. 7 r ti*rtion of ootimum coonng method. 7'.6 Application of'selected cooling method to electro-thermal analog. 8. NATURAL METHODS OF C00LIN6 ft 1 Theory. 5".2 Natural methods of cooling electronic 8.3 Thermal design of equipment top nwif. 19 1 i ? 21 22 24 24 27 27 29 34 37 37 j / 40 42 42 44 47 47 eet DO ft* Source: http://www.assistdocs.com -- Downloaded: 2013-02-25T14:18Z Check the source to verify that this is the current version before use.sMssMaesBM^^

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