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MIL-HDBK-338 15 OCTOBER 1984 TABLE OF CONTENTS PARAGRAPH PAGE 1.0 SCOPE 1-1 1.1 GENERAL INFORMATION 1-2 1.1.1 HISTORY OF COMPONENT RELIABILITY 1-3 1.1.1.1 INTRODUCTION 1-3 1.1.1.2 VACUUM TUBE ERA (1940 - 1950) 1-3 1.1.1.3 THE RELIABILITY DECADE AND THE EMER- 1-4 GENCE OF THE TRANSISTOR (1950 - 1960) 1.1.1.4 THE DECADE OF THE INTEGRATED 1-7 CIRCUIT (1960 - 1970) 1.1.1.5 DECADE OF THE LARGE SCALE INTEGRATED 1-9 CIRCUIT (LSI) (1970 - 1980) 1.1.1.6 THE DECADE OF VERY LARGE SCALE INTE- 1-11 GRATED CIRCUITS (VLSI) AND VERY HIGH SPEED INTEGRATED CIRCUITS (VHSIC) (1980) 1.1.1.7 EPILOGUE 1-12 REFERENCES 1-12 1.1.2 NEED FOR RELIABLE COMPONENTS 1-14 1.1.2.1 INTRODUCTION 1-14 1.1.2.2 COMPONENT SAFETY 1-14 1.1.2.3 NON-REPAIRABLE EQUIPMENT SITUATIONS 1-15 1.1.2.4 CRITICAL FUNCTIONS APPLICATIONS 1-16 1.1.2.5 LIFE CYCLE COMPONENT COST 1-16 1.1.3 PRESENT STATE OF THE ART 1-18 1.1.3.1 SEMICONDUCTOR TECHNOLOGY AND MATERIALS 1-18 1.1.3.1.1 CLASSES OF SEMICONDUCTOR 1-18 DEVICES 1.1.3.2 SEMICONDUCTOR DEVICE MATERIALS AND 1-20 PROCESSING 1.1.3.2.1 PHOTOFABRICATION 1-20 1.1.3.2.2 PHOTOLITHOGRAPHY 1-22 1.1.3.2.3 FILM TYPE INTEGRATED CIRCUITS 1-22 1.1.3.3 PACKAGING 1-24 1.1.3.4 TESTING OF ELECTRONIC PARTS 1-25 REFERENCES 1-28 1.1.4 FUTURE TRENDS 1-29 1.1.4.1 VHSIC 1-29 1.1.4.2 OTHER NEW TECHNOLOGIES 1-31 REFERENCES 1-35 2.0 REFERENCED DOCUMENTS 2-1 2.1 ISSUES OF DOCUMENTS 2-1 3.0 DEFINITIONS 3-1 4.0 RELIABILITY THEORY 4-1 4.1 INTRODUCTION 4-1 4.1.1 DEFINITIONS 4-1 i i i

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