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MIL-HDBK-217F 14.3 SWITCHES, ROTARY SPECIFICATION MIL-S-3786 DESCRIPTION Rotary, Ceramic or Glass Wafer, Silver Alloy Contacts Xp = ^CYC^E Faiiures/1 6 Hours Base Failure Rate - X^ Cycling Factor - ticyC Base failure rate model (X^): " *bE + n^bF (for Ceramic RF Wafers) * *bE + n X^Q (for Rotary Switch Medium Power Wafers) n - Number of Active Contacts Description MIL-SPEC Lower Quality ^bE .0067 .10 .00003 .02 ^toG .00003 .06 Load Stress Factor - tcl Stress S Load Type Stress S Resistive inductive Lamp 0.05 1.00 1.02 1.06 0.1 1.02 1.06 1.28 0.2 1.06 1.28 2.72 0.3 1.15 1.76 9.49 0.4 1.28 2.72 54.6 0.5 1.48 4.77 0.6 1.76 9.49 0.7 2.15 21.4 0.8 2.72 0.9 3.55 1.0 4.77 Operating Load Current Rated Resistive Load Current nL nL exp (S/.8)2 exp (S/.4)2 exp (S/.2)2 for Resistive Load for Inductive Load for Lamp Load NOTE: When the Switch is Rated by Inductive Load, then use Resistive 7tL. Switching Cycles per Hour *CYC <, 1 Cycle/Hour 1.0 > 1 Cycle/Hour Number of Cycles/Hour Environment Factor - n. Environment *E GB 1.0 GF 3.0 GM 18 NS 8.0 Nu 29 AIC 10 AIF 18 AUC 13 AUF 22 ARW 46 SF .50 MF 25 ML 67 CL 1200 14-31

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